Advanced Ceramics

Choose your convenient material

Why Ceramics?

Advanced ceramics is an excellent cost-effective, high-performance alternative to traditional materials such as metals, plastics and glass.

They offer unique and amazingly powerful physical, thermal and electrical properties which can provide perfect solutions as well as open a whole new world of development opportunities, for manufacturers in a wide range of industries.

Physical Properties

Ceramics properties include high strength, hardness, compressive resistance impact, wear and scratch resistance.

Machinability

Processing techniques for fabrication of ceramics parts include grinding, milling, casting and cutting, etc. Dimensional accuracy can reach μm level.

Surface Appearance

Glossy with beautiful colors, high refractive index and strong dispersion.

Comfortable Vision and Touch

Ceramics are skin-friendly, with low thermal conductivity, beautiful appearance and feel similar to Jade. Colors can be customized.

Electrical Properties

Ceramics provide high dielectric constant, superb insulation, sensitive signal, and wireless charging options.

Chemical Stability

Resistant to all types of acid, alkali and organic corrosion, won’t sustain any damage even if placed in boiled aqua regia for a few hours.

Mature mass production capability

The main forming process includes dry pressing, injection, tape casting and gelling.

Safe and Non-Toxic

Sintered at temperature above 1350℃, ensure parts have no impurities, no magnetism, no contamination, no bacteria breeding and are easy to clean.

We mainly work on these ceramic materials...

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Zirconia

Compressive Strength: 1800~2300 MPa
Density: 5.7~6.05 g/cm³
Flexural Strength: 270~1200 MPa
Fracture Toughness: 10 MPa.m^1/2
Hardness: 11.5~12.5 GPa
Maximum Temperature: 500~1000 ℃
Thermal Conductivity: 2 W/mK
Thermal Expansion: 6.9~10.5 [10^-6/K]
Volume Resistivity: 10 [ohm-cm*10^10]

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Alumina 99.5%

Compressive Strength: 3000 MPa
Density: 3.9 g/cm³
Flexural Strength: 350 MPa (99.7% 20℃)
Fracture Toughness: 4 MPa.m^1/2
Hardness: 17 GPa
Maximum Temperature: 1750 ℃
Thermal Conductivity: 28 W/mK
Thermal Expansion: 8.2 [10^-6/K] 25-600℃
Volume Resistivity:10000 [ohm-cm*10^10]

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Silicon Carbide

Compressive Strength: 3000 MPa
Density: 3.1 g/cm³
Flexural Strength: 300 MPa
Fracture Toughness: 3.5 MPa.m^1/2
Hardness: 23 GPa
Maximum Temperature: 1800 ℃ (Inert)
Thermal Conductivity: 130 W/mK
Thermal Expansion:5.5 [10^-6/K] 25-1000℃
Volume Resistivity: 1000 [ohm-cm*10^10]

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Silicon Nitride

Compressive Strength: 3000 MPa
Density: 3.21 g/cm³
Flexural Strength: 850 MPa
Fracture Toughness: 8.5 MPa.m^1/2
Hardness: 16 GPa
Maximum Temperature: 1200 ℃
Thermal Conductivity: 25 W/mK
Thermal Expansion: 3.5 [10^-6/K] 25-1000℃
Volume Resistivity:10000 [ohm-cm*10^10]