Advanced Ceramics

Choose your convenient material

Why Ceramics?

Advanced ceramics provide the perfect solution and a cost-effective, high performance alternative to traditional materials such as metals, plastics and glass. They offer unique and amazingly powerful physical, thermal and electrical properties that have opened up a whole new world of development opportunities for manufacturers in a wide range of industries.

Physical Properties
High strength, toughness, hardness, compressive resistance and impact resistance, wear resistance, scratchless.

Machinability
Grinding, milling, casting and cutting and other techniques processing are available, the dimensional accuracy can reach μm level.

Surface Appearance
Glossy visible with beautiful color, high refractive index and strong dispersion.

Comfortable Vision and Touch
Jade touch sense, skin-friendly, low thermal conductivity, beautiful appearance, customized color available.

Electrical Properties
High dielectric constant, good insulation, sensitive signal, wireless charging available.

Chemical Stability
All kinds of acid resistant, alkali and organic corrosion, without damage even in the boiled aqua regia for a few hours.

Mature mass production capability
The main forming process includes dry pressing, injection, tape casting and gel.

Safe and Non-Toxic
Sintered over 1350℃, no impurities, no magnetism, no contamination, no bacteria breeding, easy to clean.

We mainly work on these ceramic materials...

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Zirconia

Compressive Strength: 1800~2300 MPa
Density: 5.7~6.05 g/cm³
Flexural Strength: 270~1200 MPa
Fracture Toughness: 10 MPa.m^1/2
Hardness: 11.5~12.5 GPa
Maximum Temperature: 500~1000 ℃
Thermal Conductivity: 2 W/mK
Thermal Expansion: 6.9~10.5 [10^-6/K]
Volume Resistivity: 10 [ohm-cm*10^10]

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Alumina 99.5%

Compressive Strength: 3000 MPa
Density: 3.9 g/cm³
Flexural Strength: 350 MPa (99.7% 20℃)
Fracture Toughness: 4 MPa.m^1/2
Hardness: 17 GPa
Maximum Temperature: 1750 ℃
Thermal Conductivity: 28 W/mK
Thermal Expansion: 8.2 [10^-6/K] 25-600℃
Volume Resistivity:10000 [ohm-cm*10^10]

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Silicon Carbide

Compressive Strength: 3000 MPa
Density: 3.1 g/cm³
Flexural Strength: 300 MPa
Fracture Toughness: 3.5 MPa.m^1/2
Hardness: 23 GPa
Maximum Temperature: 1800 ℃ (Inert)
Thermal Conductivity: 130 W/mK
Thermal Expansion:5.5 [10^-6/K] 25-1000℃
Volume Resistivity: 1000 [ohm-cm*10^10]

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Silicon Nitride

Compressive Strength: 3000 MPa
Density: 3.21 g/cm³
Flexural Strength: 850 MPa
Fracture Toughness: 8.5 MPa.m^1/2
Hardness: 16 GPa
Maximum Temperature: 1200 ℃
Thermal Conductivity: 25 W/mK
Thermal Expansion: 3.5 [10^-6/K] 25-1000℃
Volume Resistivity:10000 [ohm-cm*10^10]